Lead-Free Low Melt 38g BGA soudure Paste (Sn42/Bi58) - 138°C Melting Point (PolarTronix)

Lead-Free Low Melt 38g BGA soudure Paste (Sn42/Bi58) - 138°C Melting Point (PolarTronix) – Image 2

Lead-Free Low Melt 38g BGA soudure Paste (Sn42/Bi58) - 138°C Melting Point (PolarTronix) – Image 3

Lead-Free Low Melt 38g BGA soudure Paste (Sn42/Bi58) - 138°C Melting Point (PolarTronix) – Image 4

Lead-Free Low Melt 38g BGA soudure Paste (Sn42/Bi58) - 138°C Melting Point (PolarTronix) – Image 5

Lead-Free Low Melt 38g BGA soudure Paste (Sn42/Bi58) - 138°C Melting Point (PolarTronix) – Image 6

Lead-Free Low Melt 38g BGA soudure Paste (Sn42/Bi58) – 138°C Melting Point (PolarTronix)

9,23 € TTC

9 en stock

Expédition rapide, colis suivi
Paiement 100 % sécurisé
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Retour possible sous 14 jours

UGS : 107183138499 Catégorie : Outils et consommables

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Description

High-Viscosity No-Clean BGA Flux Solder Paste – 38g Syringe Upgrade your soldering work with this High-Viscosity No-Clean BGA Flux Solder Paste, perfect for a wide range of electronic repairs and rework, including iPad, iPhone, PS5, PS4, and Xbox HDMI port replacements. It effectively reduces the melting point of old solder, ensuring a smoother and more efficient repair process. Size: 38 grams in a generous syringe, offering great value compared to other brands. Versatility: Ideal for reballing, SMD chip replacements, and various soldering tasks, including: iPad, iPhone, PS5, PS4, and Xbox HDMI port repairs Reballing and chip rework on phone and computer components Longevity: 6 months shelf life after opening the syringe, ensuring long-lasting usability. Performance: High viscosity formula with no-clean properties, perfect for PCB, SMD, and BGA work without leaving residue. Efficiency: Reduces the melting point of old solder, improving the efficiency of your repairs and rework projects.