Description
High-temperature solder paste with a 215℃ melting point for advanced reflow and rework applications Ideal for multilayer logic board repair, IC installation, pad rebuilding and high-heat operations Provides strong, durable solder joints capable of withstanding elevated operating temperatures Smooth application for precise placement on fine-pitch and micro-components 50g container suitable for professional repair labs and high-volume workflows YCS solder paste formulated for stability, consistency and reliable performance under heat
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