Promax Mid-layer General-purpose Tin Planting Platform pour iPhone 13 Series (YCS)

Description

Tin mesh designed for precise reballing of iPhone 13 Pro Max logic board solder pads Restores damaged or missing pad structures during multilayer and IC-level repair Ensures accurate alignment and uniform solder distribution across reworked sections Ideal for CPU, PMIC and mid-layer component reballing on the iPhone 13 Pro Max High-temperature resistant mesh suitable for professional microsoldering tasks YCS mesh engineered for consistency, accuracy and durability in board-level rework