Description
Mid-layer solder mesh designed for precise reballing of iPhone 16 Pro and 16 Pro Max multilayer logic boards Restores damaged or missing solder points across internal board layers Ensures accurate alignment during reconstruction of middle-layer solder pads Ideal for repairing CPU, PMIC and complex IC modules in the iPhone 16 Pro series High-temperature resistant mesh optimized for professional microsoldering environments YCS mesh engineered for consistent accuracy in advanced board-level rework
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