Description
Universal middle frame reballing platform engineered for iPhone 17 series logic board repair Provides stable positioning for CPU, PMIC and middle-frame ICs during reballing and high-precision soldering Adjustable design supports multiple iPhone 17 series frame layouts for versatile use Heat-resistant build ensures durability under rework station temperatures Improves alignment accuracy and reduces component movement during repair Designed for professional microsoldering workflows and compatible with Qianli rework tools
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