Description

The YCS DB02 Multi-Function Spudger Blade Set is designed for mobile phone CPU, NAND Flash, and IC chip glue removal, providing precision and control during motherboard and board-level repair work. Includes a non-slip textured handle that offers a stable grip for safe scraping, lifting, and glue removal around delicate components. Equipped with strong, durable blades suitable for removing hard glue, underfill, and residue found around BGA chips. Comes in a premium metal storage case that is sturdy, portable, and convenient for technicians who work on the go. The 9-in-1 kit includes three 9G handles and six interchangeable blades to support various disassembly and repair needs. Lightweight design reduces operator fatigue and improves overall repair efficiency during long work sessions. Suitable for multiple repair scenarios, including mobile phones, tablets, electronic circuits, and other digital device repairs. Specifications: Model YCS DB02; product size 140 × 8 mm; packaging size 60 × 175 × 20 mm. Package includes: 1 × metal case, 3 × 9G handles, 6 × blades.