Description
3in1 precision reballing platform designed for iPhone 17, 17 Pro and 17 Pro Max middle frame IC work Securely holds frames and chips to maintain stability during reballing and high-precision soldering Machined structure ensures accurate alignment and consistent solder ball placement Ideal for CPU, PMIC and key component reballing on iPhone 17 series logic boards Heat-resistant and durable material optimized for repeated professional repair use Compatible with Qianli rework stations and standard microsoldering workflows
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