Description

The YCS 2S Chip Heating Platform is designed for mobile phone and iPhone IC glue removal, providing safe and efficient heating for chip debonding and repair work. Comparable to the MaAnt SL-2 CPU Chip Glue Heating Removal Station, this platform supports IC chip heating, glue softening, and preheating for improved reballing and desoldering results. Ideal for removing hard glue from mobile phone motherboard IC chips and preparing BGA chips for repair or reballing. Features precise temperature control for targeted heating, ensuring safer and more effective glue removal without damaging components. Durable, compact, and portable design makes it suitable for various repair scenarios and easy to carry between workstations. User-friendly operation helps technicians work more efficiently, especially during IC chip manipulation, soldering, and board-level repair tasks. Note: The original YCS 2S CPU Chip Glue Heating Platform is discontinued; an alternative option is the MaAnt SL-2 Heating Removal Station.