Description
Mid-layer solder mesh designed for accurate reballing of iPhone 17, 17 Pro and 17 Pro Max multilayer boards Ensures precise restoration of solder points across middle layers during board-level repair Improves alignment and consistency when rebuilding damaged or missing solder pads Ideal for CPU, PMIC and multilayer IC repair on iPhone 17 series logic boards High-temperature resistant mesh compatible with professional microsoldering workflows YCS mesh optimized for reliability and accuracy in advanced logic board rework
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