Description
Amtech NC-559-V2 No-Clean Solder Paste in a 35g syringe for controlled dispensing during BGA/SMD rework and PCB assembly. Melting point: 183 °C (361 °F) . Key specs: Sn63/Pb37 (leaded) • T3 powder • 25–45 µm • 87% metal content • No-Clean flux • 35g syringe. Use cases: BGA/SMD rework, stencil and touch-up work, PCB assembly and repair where precise paste placement is required.










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